Detailed Thermal, Fire, and Mechanical Study of Silicon-Modified Epoxy Resin Containing Humic Acid and Other Additives

Following a waste-to-wealth approach, humic acid (HA) was exploited as flame retardant additive. The effect of its addition alone and in combination with urea (UR) ammonium polyphosphate (APP) on the thermal, fire, mechanical performances bisphenol A diglycidyl ether (DGEBA)-based epoxy resin modified (3-aminopropyl)-triethoxysilane (AP) cured aliphatic isophoronediamine (IDA) has been investigated. Unlike previous studies, UL 94-V-0 classification achieved for containing HA at 6 wt % APP only 1 phosphorus (P) loading. presence silicon-modified chains ameliorated distribution biowaste within resin, avoided melt dripping. Besides, UR promoted remarkable reduction (up to 52%) peak heat release rate (pHRR) values significant delay 21%) time ignition cone calorimetry tests, hence an increase 1.8 min) flashover, without any detrimental overall behavior. evolved gas, fire analysis used propose combined mode action HA, UR, APP, silicon performance improvement hybrid system.